Colovore Joins Global Leaders At DICE

Colovore has announced that Michael Fulkerson, Vice President of Facilities & Operations, will speak on a featured panel at the DICE Data Center Management, Operations & Cooling-West conference in Santa Clara, CA, taking place October 2, 2025.

The panel, The Future of Data Center Cooling: How Will High Density Chips Impact Cooling and Power Infrastructure?, will explore the escalating technical challenges operators face as GPUs push toward 1000kW per rack. This exponential rise in density is forcing the industry to rethink every layer of facility design from heat rejection and cooling efficiency to power delivery and long-term scalability. Panelists will share how leading organizations are preparing for these near-term realities and what innovations are needed to sustain the next wave of digital infrastructure growth.

Mike Fulkerson Session Details:
WHAT: The Future of Data Center Cooling: How Will High Density Chips Impact Cooling and Power Infrastructure? – Expert Panel Discussion

WHEN: 9:55 AM – 10:50 AM PST on Thursday, October 2, 2025

WHERE: Santa Clara Marriott, 2700 Mission College Blvd. Santa Clara, CA 95054

WHO: Michael Fulkerson, VP Facilities & Operations, Colovore
Kunal Desai, Sr Manager, Facilities Engineering, Google
Cosimo Pecchioli, Director, IT Hardware & OEM Partnership, BP
Bill Evanger, Director MTDC & High Density Critical Infrastructure, Wesco
Phil Read, Sr Director, Colocation Product Management, Equinix
Calum Devlin, Manager, CoolIT Systems

www.colovore.com